LCMXO2-2000HC-4FTG256I MachXO2 FPGA IC Chip 206 75776 2112 256-LBGA
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Specifications of LCMXO2-2000HC-4FTG256I
| TYPE | DESCRIPTION |
| Category | Integrated Circuits (ICs) |
| | Embedded |
| | FPGAs (Field Programmable Gate Array) |
| Mfr | Lattice Semiconductor Corporation |
| Series | MachXO2 |
| Packaging | Tray |
| Number of LABs/CLBs | 264 |
| Number of Logic Elements/Cells | 2112 |
| Total RAM Bits | 75776 |
| Number of I/O | 206 |
| Voltage - Supply | 2.375V ~ 3.465V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 256-LBGA |
| Supplier Device Package | 256-FTBGA (17x17) |
| Base Product Number | LCMXO2-2000 |
Features of LCMXO2-2000HC-4FTG256I
• High Performance, Flexible I/O Buffer
• Programmable sysIO™ buffer supports wide range of interfaces:
– LVCMOS 3.3/2.5/1.8/1.5/1.2
– LVTTL
– PCI
– LVDS, Bus-LVDS, MLVDS, RSDS, LVPECL
– SSTL 25/18
– HSTL 18
– Schmitt trigger inputs, up to 0.5 V hysteresis
• I/Os support hot socketing
• On-chip differential termination
• Programmable pull-up or pull-down mode
• Flexible On-Chip Clocking
• Eight primary clocks
• Up to two edge clocks for high-speed I/O interfaces (top and bottom sides only)
• Up to two analog PLLs per device with fractional-n frequency synthesis
– Wide input frequency range (7 MHz to 400 MHz)
• Non-volatile, Infinitely Reconfigurable
• Instant-on – powers up in microseconds
• Single-chip, secure solution
• Programmable through JTAG, SPI or I2C
• Supports background programming of non-volatile memory
• Optional dual boot with external SPI memory
• TransFR™ Reconfiguration
• In-field logic update while system operates
• Enhanced System Level Support
• On-chip hardened functions: SPI, I2C, timer/counter
• On-chip oscillator with 5.5% accuracy
• Unique TraceID for system tracking
• One Time Programmable (OTP) mode
• Single power supply with extended operating range
• IEEE Standard 1149.1 boundary scan
• IEEE 1532 compliant in-system programming
• Broad Range of Package Options
• TQFP, WLCSP, ucBGA, csBGA, caBGA, ftBGA, fpBGA, QFN package options
• Small footprint package options
– As small as 2.5 mm x 2.5 mm
• Density migration supported
• Advanced halogen-free packaging
Descriptions of LCMXO2-2000HC-4FTG256I
The MachXO2 PLDs are available in a broad range of advanced halogen-free packages ranging from the space
saving 2.5 mm x 2.5 mm WLCSP to the 23 mm x 23 mm fpBGA. MachXO2 devices support density migration
within the same package. Table 1-1 shows the LUT densities, package and I/O options, along with other key
parameters.
Environmental & Export Classifications of LCMXO2-2000HC-4FTG256I
| ATTRIBUTE | DESCRIPTION |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| REACH Status | REACH Unaffected |
| ECCN | 3A991D |
| HTSUS | 8542.39.0001 |
Product Tags:
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LCMXO2-2000HC-4FTG256I MachXO2 FPGA IC Chip 206 75776 2112 256-LBGA Images
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